Electronic speckle pattern interferometry technique for the measurement of complex mechanical structures for aero-spatial applications

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dc.contributor.authorRestrepo, R.
dc.contributor.authorUribe-Patarroyo, N.
dc.contributor.authorGarranzo, D.
dc.contributor.authorPintado, J.M.
dc.contributor.authorFrovel, M.
dc.contributor.authorBelenguer, T.
dc.contributor.departmentUniversidad EAFIT. Departamento de Ciencias Básicasspa
dc.contributor.researchgroupÓptica Aplicadaspa
dc.date.accessioned2021-04-12T14:18:27Z
dc.date.available2021-04-12T14:18:27Z
dc.date.issued2010-01-01
dc.description.abstractUsing the electronic speckle pattern interferometry (ESPI) technique in the in-plane arrangement, the coefficient of thermal expansion (CTE) of a composite material that will be used in a passive focusing mechanism of an aerospace mission was measured. This measurement with ESPI was compared with another interferometric method (Differential Interferometer), whose principal characteristic is its high accuracy, but the measurement is only local. As a final step, the results have been used to provide feedback with the finite element analysis (FEA). Before the composite material measurements, a quality assessment of the technique was carried out measuring the CTE of Aluminum 6061-T6. Both techniques were compared with the datasheet delivered by the supplier. A review of the basic concepts was done, especially with regards to ESPI, and the considerations to predict the quality in the fringes formation were explained. Also, a review of the basic concepts for the mechanical calculation in composite materials was done. The CTE of the composite material found was 4.69X10-6 ± 3X10-6K-1. The most important advantage between ESPI and differential interferometry is that ESPI provides more information due to its intrinsic extended area, surface deformation reconstruction, in comparison with the strictly local measurement of differential interferometry. © 2010 Copyright SPIE - The International Society for Optical Engineering.eng
dc.identifierhttps://eafit.fundanetsuite.com/Publicaciones/ProdCientif/PublicacionFrw.aspx?id=5492
dc.identifier.doi10.1117/12.870673
dc.identifier.issn0277786X
dc.identifier.issn1996756X
dc.identifier.otherWOS;000287657900047
dc.identifier.urihttp://hdl.handle.net/10784/27970
dc.language.isoengeng
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.rightshttps://v2.sherpa.ac.uk/id/publication/issn/0277-786X
dc.sourceProceedings of SPIE
dc.subject.keywordCoefficient of thermal expansioneng
dc.subject.keywordDifferential interferometerseng
dc.subject.keywordElectronic speckle pattern interferometryeng
dc.subject.keywordFinite element analysiseng
dc.subject.keywordIn-planeeng
dc.subject.keywordComposite materialseng
dc.subject.keywordFinite element methodeng
dc.subject.keywordInterferometerseng
dc.subject.keywordMotion compensationeng
dc.subject.keywordSpeckleeng
dc.subject.keywordThermal expansioneng
dc.subject.keywordThermal stresseng
dc.subject.keywordInterferometryeng
dc.titleElectronic speckle pattern interferometry technique for the measurement of complex mechanical structures for aero-spatial applicationseng
dc.typeinfo:eu-repo/semantics/conferencePapereng
dc.typeconferencePapereng
dc.typeinfo:eu-repo/semantics/publishedVersioneng
dc.typepublishedVersioneng
dc.type.localDocumento de conferenciaspa

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