REVaMP2 Project: Towards Round-Trip Engineering of Software Product Lines - Approach, Intermediate Results and Challenges

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dc.citation.journalTitleLecture Notes In Computer Scienceeng
dc.contributor.authorMazo, R.
dc.contributor.departmentUniversidad EAFIT. Departamento de Ingeniería de Sistemasspa
dc.contributor.researchgroupI+D+I en Tecnologías de la Información y las Comunicacionesspa
dc.creatorMazo, R.
dc.date.accessioned2021-04-12T20:55:48Z
dc.date.available2021-04-12T20:55:48Z
dc.date.issued2019-11-01
dc.identifierhttps://eafit.fundanetsuite.com/Publicaciones/ProdCientif/PublicacionFrw.aspx?id=10028
dc.identifier.doi10.1007/978-3-030-29852-4_34
dc.identifier.issn03029743
dc.identifier.issn16113349
dc.identifier.urihttp://hdl.handle.net/10784/28633
dc.language.isoengeng
dc.publisherSPRINGER
dc.relationDOI;https://doi.org/10.1007/978-3-030-29852-4_34
dc.rightshttps://v2.sherpa.ac.uk/id/publication/issn/0302-9743
dc.sourceLecture Notes In Computer Science
dc.titleREVaMP2 Project: Towards Round-Trip Engineering of Software Product Lines - Approach, Intermediate Results and Challengeseng
dc.typeinfo:eu-repo/semantics/articleeng
dc.typearticleeng
dc.typeinfo:eu-repo/semantics/publishedVersioneng
dc.typepublishedVersioneng
dc.type.localArtículospa

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